Strategies in meeting 99.5 percent assembly yield for company X by Trend Analysis and Learning Curve/ Eldrin Neil C. Perey

Year : 2012

Number of Pages: 36 leaves

Adviser : Prof. Glen A. Imbang

Executive Summary

The MEMS assembly yield output of Company X has been steadily increasing, although the performance has been short of the 99.5 percent minimum assembly yield output of the company's other products. The time it takes to for the yield to reach 99.5 percent is projected given its steady growth. The defects reduction trend in the different process stations were analyzed based on impact and the best trend line model, which translated on how these would be helpful in projecting improvements. However, the quantitative method approach of Trend Analysis might not be completely reliable and that specific actions should be laid out. Each process defect trend was subjected to a learning curve analysis and interpreted for how further defect reduction can be obtained. Further application of learning curve leads to analysis of learning spillovers that could possibly increase the rate of cost reduction. However, management should decide if the company will be willing to exchange the proprietary reduction for this decrease in cost. An Operation system model for process improvement, based on Trend Analysis and Learning Curve, has been created in order to provide a quick snapshot for management on how future process improvement projects should be generated. The decision to weigh on the investment against the gains relies on the company's management team. Management should continue to capitalize on the high improvement gains on Seal, Wirebond, Particle and Die Attach, but the application of improvement projects may need to be reviewed as the gains on some of the station have started to level off. More focus needs to be given to Die Preparation.